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TRIMMING and THIN LAYER ABLATION
BLS HS Bright 3000 trimmer - BLS Hifilm2000 |
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BLS Hifilm2000
 Applications:
- Cutting of dielectric layers on glass panels.
- The cutt out area has to be electrically isolated from the rest of the panel.
Solutions:
- A gantry X-Y-Z system with flying optics.
Features:
- DPSS Nd:YAG laser, 1064nm.
- Power 45 Watt (quasi mono mode).
- Spot diameter: 150µ.
- Mechanical range: 2200 x 2000 mm.
- Cutting speed up to 600mm/sec.
- Easy programming with upload of DXF drawings.
- Job queuing for later processing.
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Benefits:
- A cost effective production unit.
BLS HS Bright 3000 trimmer
Applications:
- Trimming of multi layers on solar panels.
- High speed trimming over large areas, 1200 mm x 1200 mm.
- Different wave lengths must be used in order to cut only one layer at the time
Solutions:
- The BLS HS3000.
- High speed dynamic large area scanners.
- Diode pumped AION Laser.
- Two laser heads linked to one scanner head.
- Two wave lengths : 1064 nm and 532 nm.
- TEM00 units of 16 and 8 watt.
Features:
- The BLS HS3000 is an on line laser ablation unit with dynamic optical Z axis and X-Y scanners for ablating surfaces up to 1200 x 1200 mm.
- Cutting line width: 75 µm (Spot diameter).
- The trimming surface depends on the required spot quality.
- Q-Switch repetition rates: up to 100 kHz.
- Iternal closed loop water cooler.
Benefits:
- A high productivity tool.
- Two laser units combined in one scanner head.
- Cutting speeds: 2000 mm/sec with spot overlap.
Download our Thin Layer Ablation Trimming information (PDF version)
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